Semiconductor Process Development and Integration With SEMulator3D
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YouTubeNNIN Computation Program .at University of Mi…
Dr. Assawer Soussou, semiconductor process and integration (SPI) engineer in our Semiverse™ Solutions group, explores how our SEMulator3D® process simulation software played a crucial role in identifying the vulnerabilities of a 3 nm back end of line (BEOL) process scheme using a semi-damascene integration with airgap structures. https://bit.ly/3EmNAf6 | Lam Research Corporation
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Dr. Assawer Soussou, semiconductor process and integration (SPI) engineer in our Semiverse™ Solutions group, explores how our SEMulator3D® process simulation software played a crucial role in identifying the vulnerabilities of a 3 nm back end of line (BEOL) process scheme using a semi-damascene integration with airgap structures. https://bit.ly/3EmNAf6 | Lam Research Corporation
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With the shift towards 3D DRAM, 3D logic, and multi-layer NAND stacks, managing mechanical stress in semiconductor manufacturing is more crucial than ever.Our SEMulator3D® integrates stress… | Lam Research
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With the shift towards 3D DRAM, 3D logic, and multi-layer NAND stacks, managing mechanical stress in semiconductor manufacturing is more crucial than ever.Our SEMulator3D® integrates stress… | Lam Research
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#半导体 #虚拟仿真 SEMulator3D助力半导体工艺窗口评估与优化
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Using SEMulator3D® virtual DOEs (Design of Experiments), we built a virtual FinFET model study to determine whether adding a source/drain contact recess (CT) process reduces parasitic capacitance without substantially impacting resistance. Here’s what we learned. https://bit.ly/4cA2PA0 | Lam Research Corporation
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Our SEMulator3D® for virtual fabrication helps engineers predict and mitigate stress-related issues early in the process. See how our tool tracks stress evolution across each manufacturing step, allowing engineers to proactively optimize yield and performance. https://bit.ly/3ECeCCO | Lam Research Corporation
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